7AF-HMG Internal Flat Lapping Machine
- Model: 7af-hmg-grinding-machine
Product Description
Revasum’s 7AF-HMG grinding solutionextends wheel life by nine times, increasesuptime by 10%, boosts wafer output by 15
percent, and reduces the cost of ownership by seven times. With a return on investment of less than one year, the choice for SiC grinding is clear: choose the 7AF-HMG.
- Real-time grind performance monitoring
- A self-dressing grind process
- Astounding performance on wire sawn SiC wafers