Semiconductor Lapping and Polishing Machine Carlap 2000
- Model: cl-2000-semiconductor
- Type/Application: Double Sided
- Plate-Diameter (mm): 2000 mm
Product Description
2000 series machines are designed to Lap and Polish components on a 5 carrier format (40 mm Max component size). The components are placed in off-set position in the carrier to ensure full coverage of the lapping plate.