AC 2000 P5

NEXT GENERATION OF PRECISION WAFERING TECHNOLOGY

 

With its patented UPAC-system the AC 2000 P5 enables highest flexibility for polishing silicon prime wafers. Hereby the AC 2000 P5 combines optimized throughout and Cost of Ownership.

• True-Productivity: Up to 30 % increased throughput
• Factual Stability: Homogenous polishing over dozens of batches.

 

Characteristics AC 2000 P5

• Unique and patented UPAC (Upper Platen Adaptive Control) System
• Unique LPAC (Lower Platen Adaptive Control) System
• In-Situ Wafer profile measurement
• Optimized cooling system
• Sensor Interfaces in polishing wheels
• Digitized media flow control
• Sensor control
• High-pressure conditioning
• Pad thickness measurement
• Additional Sensor-Kit
• Polishing media recycling station

 

WAFER UP TO 300 mm / 12 ''
15 WAFER / BATCH