Semiconductors
With a foundation built on more than a century of expertise in high-precision surface processing, the company has developed an extensive portfolio of lapping, polishing, grinding, and wafer handling systems that support the semiconductor supply chain at multiple crucial stages. These include slicing wafers from silicon, silicon carbide (SiC), sapphire, gallium arsenide and other advanced materials; achieving nanometer-level surface flatness through fine grinding and double-side polishing; and providing specialized single-wafer processing tools that deliver the consistency and quality demanded by front-end semiconductor production.
Our Products
AC 2000 P5
The AC 2000 P5 sets market-leading standards in polishing of silicon prime wafers. With its innovational and technological advance the AC 2000 P4 combines highest throughput with optimized Cost of Ownership.
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