Introducing the 6EZ Polisher—a pioneering advancement in wafer processing technology.
Silicon carbide (SiC) is renowned for its extreme hardness and durability, but these same properties make it notoriously difficult to process. At Lapmaster-Wolters, we understand the complexities of SiC surface finishing and have engineered a breakthrough solution that redefines what’s possible in SiC polishing. As the world’s first fully-automated, dry-in-dry-out, single wafer polisher purpose-built for SiC, the 6EZ reflects Lapmaster’s deep expertise in SiC grinding, advanced wafer polishing, and CMP (Chemical Mechanical Planarization) systems.
Key Features of the Lapmaster-Wolters 6EZ
Fully-automated cassette-to-cassette wafer handling for streamlined throughput Precision single-wafer processing, ensuring consistent wafer-to-wafer performance Configurable for both single-side and double-side polishing applications Equipped with three independent polishing tables, each with dedicated carriers, pad conditioning systems, and pad cleaning stations Engineered for high-performance environments, the 6EZ from Lapmaster-Wolters, is the ideal solution for manufacturers seeking superior control, efficiency, and surface integrity when polishing SiC wafers.
FEATURES
- Fully automated, cassette-to-cassette handling
- Single wafer processing for optimal wafer-to-wafer control
- Options for single-side and double-sided polishing
- Three tables equipped with dedicated carriers, pad conditioners, and pad cleaners
- Components resistant to acid • Optional Optical Character Recognition (OCR)
- Advanced control architecture featuring a Windows-based operating system
- Two standard slurry delivery lines, with an optional third slurry line available
- Optional factory host communication
- Certified to SEMI S2, S8, and CE standards
- Capable of processing 50 wafers without operator intervention
- Integrated post-polish cleaning system
BENEFITS
- Allows control over TTV and surface quality
- Removes the need for wafer sorting
- Decreases machine-to-machine wafer transfer steps
- Minimizes wafer breakage risk
- Enhances cleanliness
- Facilitates process automation
- Boosts productivity
- Attains higher wafer yields
