Introducing the 6EZ Polisher - a pioneering advancement in wafer processing technology.

 

Silicon carbide (SiC) is renowned for its extreme hardness and durability, but these same properties make it notoriously difficult to process. At Lapmaster-Wolters, we understand the complexities of SiC surface finishing and have engineered a breakthrough solution that redefines what’s possible in SiC polishing. As the world’s first fully-automated, dry-in-dry-out, single wafer polisher purpose-built for SiC, the 6EZ reflects Lapmaster’s deep expertise in SiC grinding, advanced wafer polishing, and CMP (Chemical Mechanical Planarization) systems.

 

Key Features of the Lapmaster-Wolters 6EZ

Fully-automated cassette-to-cassette wafer handling for streamlined throughput Precision single-wafer processing, ensuring consistent wafer-to-wafer performance Configurable for both single-side and double-side polishing applications Equipped with three independent polishing tables, each with dedicated carriers, pad conditioning systems, and pad cleaning stations Engineered for high-performance environments, the 6EZ from Lapmaster-Wolters, is the ideal solution for manufacturers seeking superior control, efficiency, and surface integrity when polishing SiC wafers.

FEATURES

• Fully automated, cassette-to-cassette handling
• Single wafer processing for optimal wafer-to-wafer control
• Options for single-side and double-sided polishing
• Three tables equipped with dedicated carriers, pad conditioners, and pad cleaners
• Components resistant to acid • Optional Optical Character Recognition (OCR)
• Advanced control architecture featuring a Windows-based operating system
• Two standard slurry delivery lines, with an optional third slurry line available
• Optional factory host communication
• Certified to SEMI S2, S8, and CE standards
• Capable of processing 50 wafers without operator intervention
• Integrated post-polish cleaning system

 

BENEFITS

• Allows control over TTV and surface quality
• Removes the need for wafer sorting
• Decreases machine-to-machine wafer transfer steps
• Minimizes wafer breakage risk
• Enhances cleanliness
• Facilitates process automation
• Boosts productivity
• Attains higher wafer yields