High-Performance SiC Grinding with Lapmaster’s 7AF-HMG Precision System
At Lapmaster.com, our advanced 7AF-HMG grinder is engineered to set new industry standards in silicon carbide (SiC) substrate processing. Built for precision and reliability, the 7AF-HMG delivers up to nine times longer wheel life, 15% more wafer throughput, and a 10% increase in uptime—all while reducing overall cost of ownership by a factor of seven. With a payback period of under 12 months, it's a smart investment for high-volume SiC manufacturers.
Key Features of the Lapmaster-Wolters 7AF-HMG
Real-time performance monitoring for consistent, high-quality results. Versatile configuration support: dual fine grind, dual coarse grind, or standard coarse/fine processing Self-dressing grinding process for extended operational efficiency Wafer flipping capability for double-sided grinding operations
To maximize productivity and minimize long-term costs, discover the power of the 7AF-HMG only at Lapmaster.com
The 7AF-HMG grinding solution extends wheel life by nine times, increases uptime by 10%, boosts wafer output by 15%, and reduces the cost of ownership sevenfold. With an ROI of under one year, the 7AF-HMG is the clear choice for SiC grinding.
- Wheel life is nine times better.
- Self-dressing grind process.
- ROI within 12 months.
- 88% fewer wheel changes.
FEATURES
- Real-time grind performance monitoring is available.
- A self-dressing grind process is provided.
- Grind spindles can be equipped with either coarse or fine wheels.
- The system supports dual fine grind, dual coarse grind, and standard coarse/fine grind processing.
- Wafer flipping capability for double-side grinding applications is offered.
- In-situ, real-time thickness control is implemented.
- Air bearing spindles are equipped with 8Hp motors.
- The operating system is based on Windows 7.
BENEFITS
- Achieves <1µm TTV for most applications with excellent performance on wire sawn SiC wafers.
- It is designed to reduce consumables and operational costs and accommodates varied wafer thicknesses without presorting.
- Features a wide process window for reduced setup time and increased repeatability.
- Optimizable surface finish for subsequent processing.
- Easy maintenance and switching between wafer sizes, offering flexible process flows.
