AC 1200 DSPL-DMP-CMP

Double-sided Polishing Machine

AC 400 F Double-sided Fine Grinding Machine

The AC 1200 P3 Advanced sets market-leading standards in polishing of silicon prime wafers. With ist innovational and technological advance the AC 2000 P4 combines highest throughput with optimized Cost of Ownership.

  • Sensor technology for repeatable process results
  • Wafers with excellent flatness, parallelism, surface quality and surface roughness (TTV AVG ≤ 1 µm)

Characteristics AC 1200 DSPL-DMP-CMP Polishing Machine

Unique and patented UPAC (Upper Platen Adaptive Control) System

  • Fast and ergonomic loading and unloading
  • Upper working wheel can swivel out for total access to the process area
  • Extreme temperature stabilization over the tool surface
  • Process temperature detection
  • Excellent machining results and precision
  • Individual process development
  • Easy to maintain
  • High-precise non-contact measuring control
  • Powerful drive technology
  • Carrier guiding system
  • Optional recycling channel
  • User friendly, intuitive operation
  • High-precise pneumatic load system
  • High production reliability
  • Stable cast iron base frame
  • Siemens PLC Control and Siemens KP1200 Comfort Panel
  • Remote maintenance solution
  • RangeCare® via mobile communications or VPN

SiC Wafer Processing 4", 6" and 8" Wafer

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