AC 1500 DSPL-DMP-CMP

Double-sided Polishing Machine

AC 400 F Double-sided Fine Grinding Machine

The AC 1500 P3 Advanced sets market-leading standards in polishing of silicon prime wafers. With ist innovational and technological advance the AC 2000 P4 combines highest throughput with optimized Cost of Ownership.

  • Sensor technology for repeatable process results
  • Wafers with excellent flatness, parallelism, surface quality and surface roughness (TTV AVG ≤ 1 µm)

Characteristics AC 1500 DSPL-DMP-CMP Polishing Machine

Unique and patented UPAC (Upper Platen Adaptive Control) System

 

  • Monitoring of the cooling lubricant flow rate
  • Loop control
  • First-Class customer support for the highest machine availability and productivity
  • Slurry Recycling Station
  • Integrated Process Data Recording (DataCare®)
  • Industry 4.0
  • Touch Screen

 

SiC Wafer Processing 4", 6" and 8" Wafer

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