AC 1500 P3 Advanced

Prime Wafer Double-sided Polishing Machine

AC 400 F Double-sided Fine Grinding Machine

The AC 1500 P3 Advanced sets market-leading standards in polishing of silicon prime wafers. With ist innovational and technological advance the AC 2000 P4 combines highest throughput with optimized Cost of Ownership.

  • Patented UPAC-system for adaptive control of the polishing gap
  • Smart sensors enable highest process control

Characteristics AC 1500 P3 Advanced Polishing Machine

  • Unique and patented UPAC (Upper Platen Adaptive Control) System
  • Monitoring of the cooling lubricant flow rate
  • Loop control
  • First-Class customer support for the highest machine availability and productivity
  • High-Pressure Conditioner
  • Slurry Recycling Station
  • Slurry Pressure Distribution
  • Integrated Process Data Recording (DataCare®)
  • Industry 4.0
  • Touch Screen

Work pieces up to 12" or 300 mm diameter, 6 pieces

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