AC 2000 P3

Prime Wafer Double-sided Polishing Machine

AC 400 F Double-sided Fine Grinding Machine

With its patented UPAC-system the AC 2000 P3 enables highest flexibility for polishing silicon prime wafers. Hereby the AC 2000 P3 combines optimized throughout and Cost of Ownership.

  • Adaption of polishing gap for actively controlled working conditions enables highest quality results.
  • Industry leading standards in precision, quality, efficiency and Cost of Ownership.

Characteristics AC 2000 P4 Polishing Machine

  • Unique and patented UPAC (Upper Platen Adaptive Control) System
  • Unique LPAC (Lower Platen Adaptive Control) System (patent pending)
  • Monitoring of the cooling lubricant flow rate
  • Loop control
  • First-Class customer support for the highest machine availability and productivity
  • Integrated high precision interferometric device for in-situ measurement of the wafer thickness
  • High-Pressure Conditioner
  • Slurry Recycling Station
  • Slurry Pressure Distribution
  • Integrated Process Data Recording (DataCare®)
  • Industry 4.0
  • Touch Screen

Work pieces up to 12" or 300 mm diameter, 15 pieces

Work pieces up to 8" or 200 mm diameter, 30 pieces

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