Smart slicing technology for sapphire, and other hard and brittle materials

Based on widely adopted and successful DW 288 product family

Thanks to the sophisticated work piece rocking the diamond wire saw DW 288 S4 reaches maximum precision in slicing semiconductor silicon and sapphire into wafer. Our de­tailed tech­nol­ogy and process know-how can also be trans­ferred to ce­ram­ics, quartz or other hard and brittle materials. 

Optional available is the market-proven Diamond Wire Management System (DWMS) or the slurry media module for hard materials such as silicon carbide. 

Your benefits:

  • Rigid and temperature optimized design ensures high yield
  • Best in class for 8 inch semiconductor and sapphire industry
  • Versatile applications for different formats

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