DW296 Multi Wire Saw

Designed specifically for cutting square monocrystalline silicon bricks into ultra-thin wafers for the photovoltaic industry, the DW296 sets industry standards for thinnest wires and fastest wafer slicing times

Sophisticated wire tension management for thin wire and high acceleration reduces the wire breakage rate
Extremely high throughput for photovoltaic wafer mass production

Work piece dimensions:max. 210 x 210 x 860 mm

Characteristics DW296 Slicing Saws

• M12 capable: Optimized for 210 mm and 182 mm wafer format (other formats possible)
• Up to 100 MW throughput: 15 m/s2 acceleration, 40 m/s wire speed 30 µm wire capability
• Shortest wire path:Only < 2.0 m on one side, easywire set-up and constant tension
• High capacity: 870 mm web length
• Robust machine: Iron cast, high rigidity, perfect alignment of all relevant machine parts
• HMI: New HMI on 19″ touch screen, production assistant, global process recipes, easy to train, easy to use
• Simplified cutting fluid supply with pre-cleaning function Optional MES interface (SECS/GEM300)

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