NanoEdge - Fully Automated Edge Grinding Machine

The NanoEdge as next-gen edge grinding tool for SiC wafers, combines highest throughput with best-in-class grinding results. With its 50% higher throughput compared to similar tools in the market, it's made for highest productivity without any compromises regarding quality. The precise grinding stations realize quality results on micron level, while being fully-automated.

  • Fully-automated Dry-In / Dry-Out mechanism for three cassettes
  • Three parallel grind modules with integrated dressing
  • Real Time process monitoring
  • Processing of sic wafer - 4", 6" and 8"

 

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