12 inch wafer with the highest surface quality

The first-class surface of the slurry-sliced wafers, as well as best warp and TTV values, makes the DS 261 the leading wire saw in the 12 inch semiconductor industry.

The DS 261 yields top technological and qualitative performances and is widely used in the market.

Benefits

  • Fast and efficient cutting
  • Best warp and TTV values
  • Best nano-topological values
  • Integrated workpiece orientation

Wide range of applications - Maximum yield

Besides silicon, the versatile DS 261 also cuts other hard and brittle materials such as quartz, ceramics, sapphire or gallium arsenide in different dimensions. The high quality standard of the DS 261 from construction to processing guarantees maximum yield and best nano-topological values.

Characteristics DS261 Slicing Saws

• New operator guided HMI and electrical system on Series 7 release
• Wide range of applications: silicon, quartz, gallium arsenide and other hard & brittle material in different dimensions
• Proven slurry technology and DW ready
• Optimized slurry temperature control
• 60-step recipe enables optimal process tuning
• Automated cutting process and perfect accessability
• Optional work piece orientation

 

DOWNLOAD DATA SHEET - PDF

 

Inquiries

* Indicates A Required Field