Diamond Wire Saw for Hard and Brittle Materials
The DW 288 S6 is based on the widely used DW 288 product family. It has been optimized for 6” workpieces with material loads of up to 650 mm. The workpiece rocking technology, combined with the adaptive feed, ensures highest wafer quality, maximum throughput and lowest cost of ownership.
Whether slicing sapphire, silicon, ceramics, quartz, magnetic or other hard and brittle materials, the DW 288 S6 offers clear advantages in productivity, robustness and quality. Relevant applications include LED and smart lighting, automotive and optics, consumer electronics and aerospace.
The DW 288 S6 uses a best-in-class workpiece rocking concept for outstanding results. It enables higher accessibility and is particularly user-friendly. With its monitoring and logging capabilities, the equipment is ready for Industry 4.0.
Benefits of the DW 288 S6
- Increased throughput
- Highest precision and quality
- Robustness and durability
- Higher degree of automation
- Market-proven design
Based on in-depth understanding of the slicing process with diamond wire, leading equipment has been developed up to the DW 288 S6. Apart from its advanced electrical and mechanical system design, the software has been upgraded to ensure maximum process control and usability in modern manufacturing environments.
Characteristics DW288S6 Slicing Saws
• Smallest axis distance: Optimized for . 6″
• High capacity: 650 mm web length
• High throughput: 30 m/s wire speed, 10 m/s2 acceleration
• Latest generation work piece rocking technology
• Adaptive feed
• New CF system: Low maintenance heat exchanger, stable temperature in entire system, shortest pipe path
• Easy operation: HMI on 15″ touch screen, production assistant, easy to train, easy to use
• Recipe generator for 60-step recipe
• Ready for Industry 4.0
• Various options: i. e. Diamond Wire Management System (DWMS)
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