DW292 Multi Wire Saw

The DW292 is specifically designed for slicing mono-Si blocks into high-quality wafers for the demanding semiconductor industry. It can operate with both slurry and diamond wire and has high wafer quality features.

  • Lowest TTV and warp values
  • High throughput thanks to high wire speed and extended wire web

Work piece dimensions:

max. Ø 305 mm × 600 mm or Ø 205 mm x 650 mm

Characteristics DW292 Slicing Saws

  • Sophisticated work piece rocking for maximum precision
  • High throughput: 35 m/s wire speed, 12 m/s2 acceleration
  • DWMS: 60 μm wire capability
  • Shortest wire path: Only < 1.9 m on one side, easy wire set-up and constant tension
  • Robust machine: Mineral cast, low temperature dependency, low vibration, low noise
  • HMI: New HMI on 19″ touch screen, production assistant, global process recipes, easy to train, easy to use
  • Option: Automatic cutting fluid exchange
  • Option: MES interface (SECS / GEM)

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