Precision Excellence along the whole process chain of silicon and silicon-carbide
Lapmaster Wolters systems solutions set quality benchmarks for silicon and silicon-carbide wafering.
Decades of providing manufacturing equipment for silicon prime wafering established Lapmaster Wolters as premium supplier for system solutions on all global semiconductor markets. With its slicing and double-side processing solutions, Lapmaster Wolters offers precision excellence along the whole process chain for all kind of wafer base materials such as silicon, silicon-carbide, diamond, sapphire or glass.
Crystal Growth
Monocrystalline ingots or boules for example out of silicon, silicon-carbide or other semiconductor materials are grown highly purified to provide wafering raw material.
Ingot Trimming and OD Grinding
To provide steady wafer sizes, raw ingots or boules are trimmed by cutting the end pieces. Following the outer diameter is ground to the target thickness.
Wafer Slicing
The prepared ingots or boules are now sliced into single wafers. The quality of the cut is fundamental to increase the total yield and prevent damages in the following steps.
Edge Grinding
For following surface finishing steps, it is necessary to grind or polish wafer edges. This is necessary to increase the wafer stability when applying pressure on the material.
Wafer Lapping
Before polishing, it is necessary to bring the workpiece close to its target thickness. With high removal rates the wafer is flattened and the surface quality prepared.
Diamond-Mechanical Polishing (DMP)
Diamond-Mechanical Polishing further improves the wafer surface quality by removing damages and scratches, that appears due to more rough pre-processing.
Chemical-Mechanical Polishing (CMP)
Chemical-Mechanical Polishing removes last scratches from the wafer, by etching the surface and mechanically removal of material to reach the final target thickness.
Final CMP / Mirror Finish
In some circumstances a final CMP step could be necessary to reach desired mirror finishing results, while polishing the wafer surface and slightly removing material.