Semiconductor
With a foundation built on more than a century of expertise in high-precision surface processing, the company has developed an extensive portfolio of lapping, polishing, grinding, and wafer handling systems that support the semiconductor supply chain at multiple crucial stages. These include slicing wafers from silicon, silicon carbide (SiC), sapphire, gallium arsenide and other advanced materials; achieving nanometer-level surface flatness through fine grinding and double-side polishing; and providing specialized single-wafer processing tools that deliver the consistency and quality demanded by front-end semiconductor production.
Our Products
AC 2000 P3
With its patented UPAC-system the AC 2000 P3 enables highest flexibility for polishing silicon prime wafers. Hereby the AC 2000 P3 combines optimized throughout and Cost of Ownership.
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In addition to the proven core components such as the pneumatic loading system, the Peter Wolters AC 1200 has been specially optimized for processing SiC wafers with additional features such as the telemetric system.
With it's patented UPAC system, the Peter Wolters AC 1500 is ideally suited to throughput-optimized processing of 6" and 8" SiC wafers. In combination with the epicyclic work holder system, highest wafer qualities are achieved.
With its patented UPAC-system the AC 1500 P3 Advanced enables throughput optimized batch polishing with up to 18 200mm silicon wafers parallel. Additional installed sensors secures highest process control.
With its patented UPAC-system the AC 2000 P3 enables highest flexibility for polishing silicon prime wafers. Hereby the AC 2000 P3 combines optimized throughout and Cost of Ownership.
The AC 2000 P4 sets market-leading standards in polishing of silicon prime wafers. With its innovational and technological advance the AC 2000 P4 combines highest throughput with optimized Cost of Ownership.
Offers a high degree of flexibility and allows a wide range of workpieces to be processed in various dimensions. Despite high flexibility, maximum precision and stability are ensured.
The TS207, which is primarily dedicated to 8-inch semiconductor materials, is suitable for both cropping and wafering. In addition, many other types of material can also be processed, which leads to a high degree of flexibility.