Advanced Machine & Process Solutions for Next-Generation Materials
We deliver precision-engineered technologies for processing today’s most demanding high-performance and emerging materials. From gallium nitride (GaN) and indium phosphide (InP) to sapphire, diamond, advanced glass, and rare earth magnet alloys, our solutions are built to handle materials where accuracy is non-negotiable.
These materials require more than conventional approaches. Our systems integrate diamond-based tooling, advanced cooling strategies, and adaptive process control to reduce stress, improve surface quality, and achieve exceptional dimensional precision.
With fully customized solutions for both single-sided and double-sided processing, we provide the flexibility and control needed across a wide range of industries—including optoelectronics, precision optics, aerospace, energy, and next-generation material applications.
Our Products
AC 2000 P4
The AC 2000 P4 sets market-leading standards in polishing of silicon prime wafers. With its innovational and technological advance the AC 2000 P4 combines highest throughput with optimized Cost of Ownership.
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In addition to the proven core components such as the pneumatic loading system, the Peter Wolters AC 1200 has been specially optimized for processing SiC wafers with additional features such as the telemetric system.
With it's patented UPAC system, the Peter Wolters AC 1500 is ideally suited to throughput-optimized processing of 6" and 8" SiC wafers. In combination with the epicyclic work holder system, highest wafer qualities are achieved.
Offers a high degree of flexibility and allows a wide range of workpieces to be processed in various dimensions. Despite high flexibility, maximum precision and stability are ensured.